Etiqueta de registo: 00254nam 2200025 450
001 2203276
003 http://id.bnportugal.gov.pt/bib/catbnp/2203276
100 ## $a20250121d2024 km y0pory01030103ba
101 0# $aeng$dpor
102 ## $aPT
105 ## $aa m 000yy
106 ## $ar
200 1# $aDevelopment of barrier layers for seedless cu electroplating$fBruno M. C. Oliveira$gsupervisor Manuel Vieira, Ana Piedade, Paulo Ferreira
210 #9 $aPorto$c[s.n.],$d2024
215 ## $a111 p.$cil.$d30 cm
328 #1 $aTese dout. Materiais e Processamento Avançados, Universidade do Porto, 2024
675 ## $a620.3(043)$vBN$zpor$31386155
700 #1 $aOliveira,$bBruno M. C.$31942030
702 #1 $920$aVieira,$bManuel$4727$31942033
702 #1 $aPiedade,$bAna Paula da Fonseca$4727$3106363
702 #1 $915$aFerreira,$bPaulo$4727$31942041
801 #0 $aPT$bBN$gRPC
966 ## $lBN$mFGMON$sS.A. 189819 V.$x1
971 ## $cisantos$d20250121
972 ## $d20250213$e0$vlrevez$z0
973 ## $cigoulao$d20250129